EFECS 2021

• EFECS Presentation „IPCEI on Microelectronics – a strong European Microelectronics industry for the digital future in Europe
• More EFECS presentations:
  • Technology Field 1: Energy efficient chips (presentation with audio)
  • Technology Field 2: Power semiconductors
  • Technology Field 3: Smart sensors
  • Technology Field 4: Advanced optical equipment (presentation with audio)
  • Technology Field 5: Compound materials (presentation with audio)

ESSCIRC/ESSDERC 2020

• Pushing the limits of MEMS – Dr. Markus Sonnemann Pushing the lim Engineering MEMS, Robert Bosch GmbH, Germany

• LYNRED Advanced Developments in the Field of Infra Red Imaging technology – Patrick Abraham, Strategy, communication and Technology Department LYNRED, France

• “Merging of photonics and micro-electronics: Photonics in the UK” – Iwan Davies, IQE plc, on behalf of CSConnected, United Kingdom

• Power electronics trends 2025 – Herbert Pairitsch, IFAT PSS RDF, Infineon Technologies Austria AG

• Novel packaging concepts and their potentials for generating energy efficient electronic based systems – Hannes Voraberger, Research & Development Austria Technologie & Systemtechnik AG, Austria

• Advanced High Voltage Passive devices for Automotive and Power applications – Franck Murray, Murata Integrated Passive Solutions, France

• Innovative Fan Out Wafer Level Package – Platform for Sensors – Horst Theuss, Christian Geissler, Walter Hartner, Klaus Pressel, Infineon Technologies AG, Germany

• Progress in High NA EUV Optics Development for sub-10nm resolution – Wischmeier, Lars, Carl Zeiss SMT GmbH, Germany

• FeFET: A versatile CMOS compatible device with game-changing potential – GLOBALFOUNDRIES, Fraunhofer IPMS (CNT), NaMLab, FMC – Ferroelectric Memory Company

• Global Trends in Microelectronics and how Europe can address them – Joel HARTMANN, Executive Vice President Digital & Smart Power Technology and Digital Front End Manufacturing, STMicroelectronics

• Back side ohmic contact in 4H SiC Power Devices – Simone Rascun á Research & Development Department, STMicroelectronics, Italy

• 3D ToF sensor design and it‘s application in gesture and object recognition – Dr. Sarah Blumenthal, Elmos Semiconductor SE, Germany

• 3D isotropic Hall sensor – Dr. Laurent Osberger, Advanced Developments & Proof of Concepts TDK Micronas , Freiburg, Germany

• NIR – sensitive single photon devices (SiPM and SPADs in custom technologies), for industrial and automotive LIDAR applications – Fabio Acerbi, G. Paternoster, A., Mazzi , A. Gola, L. Ferrario, Centre for material and Microsystem, Fondazione Bruno Kessler (FBK), Italy

• IPCEI AIRI webinar 11/11/2020

EuroSimE2020

• The “Important Project of Common European Interest” (IPCEI) in Microelectronics – A new path for investment in r esearch, development and innovation by Europe’s semiconductor industry – Klaus Pressel (Infineon), Infineon), Rainer, Pforr (Zeiss), and Michael Offenberg
  
• Differential Reflective Metrology An innovative variability measurement for advanced FD-SOI material – Jean-Michel Billiez (Soitec, France)
  
• “Thermal-electric modelling of thermoelectric and electrocaloricon-chip cooling devices” – C. Schwinge, W. Weinreich, M. Wagner-Reetz (Fraunhofer IPMS CNT, Germany), S. Kolodinski, M. Wiatr (GLOBALFOUNDRIES Management Services LLC & Co.KG, Dresden, Germany)
  
• Finite Element Analysis of the Board Level Reliability of High Frequency Automotive Package Developments – IPCEI WIN-FDSOI (TF1 Energy Efficient Chips) – K. Meier, L. Wambera, K. Bock (Technische Universität Dresden, Institute of Electronic Packaging Technology, Dresden), C. Götze, M. Wieland (GLOBALFOUNDRIES, Dresden Module One LLC & Co. KG, Dresden)
  
• Power Module Ceramic Substrates: mechanical characterization and modeling – Alessandro Sitta (1,2), Marco Renna (1), Angelo Alberto Messina (1,3), Giuseppe Mirone (2), Giuseppe D’Arrigo (3), Michele Calabretta (1) – 1 STMicroelectronics SRL, Italy, 2 University of Catania, Italy, 3 CNR-IMM, Catania, Italy
  
• Reliability Requirements of Advanced Packaging in the Era of Electrified, Automated and Connected Driving – Przemyslaw Gromala, Robert Bosch GmbH Automotive Electronics
  
• Determination of Fracture Properties of Thin Dielectric Films by Nanoindentation (support of TF3 and also TF2 in IPCEI) – S. Ananiev and P. Altieri-Weimar (Infineon Technologies AG, Germany), C. Sander and A. Clausner (Fraunhofer Institute for Ceramic Technologies and Systems IKTS, Germany)
  
• FEM simulation applied to Thermal Laser Separation (TLS) with Deep Scribe for Silicon Wafer Dicing – Christian Belgardt, 3D-Micromac AG
  
• Trends and future challenges in designing and simulating high performance MEMS – Dr. Mirko Hofmann, Robert Bosch GmbH
  
• Transient Thermoelastic Structure Analysis to quantify the Thermal Stability of Extreme-Ultraviolet (EUV) Projection Systems – Timo Laufer, Carl Zeiss SMT GmbH, Oberkochen, Germany
  
• Innovative relaxed InGaN engineered substrates for RGB Micro-LEDs – D. Sotta, (Soitec S.A., 38190 Bernin, France), A. Dussaigne (University of Grenoble-Alpes, CEA, LETI, Minatec Campus, F-38054 Grenoble, France)
  
• Abstract: Differential Reflective Metrology – An innovative variability measurement for advanced FDSOI material