- Welcome to the IPCEI Focus Session at ESSDERC/ESSCIRC conference – Klaus Pressel, Infineon , Germany
- Current SiC Power Device Development, Material Defect Measurements and Characterization at Bosch – Daniel Baierhofer, Unit Process Development, Robert Bosch GmbH
- Power Packages Interconnections for High Reliability, Automotive Applications – Michele Calabretta, ADG R&D, STMicroelectornics, Italy
- Pixelated light: Merging microelectronics and photonics – Andreas Plößl, Technology Innovation, OSRAM Opto Semiconductors GmbH, Germany
- Bosch MEMS Foundry Service, Enable Customers to boost their business by using Bosch’s MEMS-expertise – Dr. Stefan Majoni, Bosch
- Micro-Transfer-Printing – A unique technology for heterogeneous integration of (opto-) electronic components – Gabriel Kittler Innovation X-FAB Semiconductor Foundries GmbH, Germany
- Silicon Photomultipliers Technology at Fondazione Bruno Kessler and 3D, Integration Perspectives – G. Paternoster, L. Ferrario , F. Acerbi , A. Gola, P. Bellutti, Fondazione Bruno Kessler, Trento, Italy
- Challenges and capabilities of 3D integration in CMOS imaging sensors – Dominique Thomas, Jean Michailos , Krysten Rochereau, Joris Jourdon , Sandrine Lhostis, STMicroelectronics , France
- Excursion Prevention Strategy to increase Chip Performance by Photomask Tuning – Ofir Sharoni, Mask Tuning, Carl Zeiss SMT, Israel
- High-NA EUV Optics –the Key for Miniaturization of Integrated Circuits in the Next Decade – Bartosz Bilski, Heiko Feldmann, Paul Gräupner, Peter Kürz, Winfried Kaiser, Carl Zeiss SMT GmbH, Germany
- 22FD-SOI Variability Improvement, Thanks to SmartCut Thickness Control at Atomic Scale – Walter Schwarzenbach, S. Loubriat, V. Joseph, L. Viravaux, O. Moreau, S. Lasserre, B.-Y. Nguyen, SOITEC, France
- How to Achieve World Leading Energy Efficiency using 22FDX with Adaptive Body Biasing on an Arm Cortex M4 IoT SoC – Sebastian Höppner, Holger Eisenreich, Dennis Walter, Uwe Steeb, Andre Scharfe, Clifford Dmello, Robert Sinkwitz, Heiner Bauer, Alexander Oefelein, Florian Schraut, Jörg Schreiter, Robert Niebsch, Stephan Scherzer, Mario Orgis, Racyics GmbH , Germany, Ulrich Hensel, Jörg Winkler, GLOBALFOUNDRIES , Germany
- Early Results from IPCEI-subcontracts supporting impact of 22-FDX – Dr. Sabine Kolodinski, Technical Lead IPCEI at GF, Senior Staff Program Management
- 22FDX™ Technology and Add-on-Functionalities – Sabine Kolodinski, Maciej Wiatr, Director & DMTS Strategic Development, GLOBALFOUNDRIES Dresden